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TLP848
2007-10-01
4
Handling and Mounting Precautions
• Care must be taken in relation to the environment in which the device is to be installed. Oil or chemicals
may cause the package to melt or crack.
• The device should be mounted on an unwarped surface.
• Do not apply stress to the resin at high temperature.
• The resin part is easily scratched, so avoid friction with hard materials.
• When installing the assembly board in equipment, ensure that this product does not come into contact with
other components.
• Conversion efficiency falls over time due to the current which flows in the infrared LED. When designing a
circuit, take into account this change in conversion efficiency over time. The ratio of fluctuation in
conversion efficiency to fluctuation in infrared LED optical output is 1:1.
Moisture-Proof Packing
• To avoid moisture absorption, the reel is packed in an aluminum bag that contains a desiccant with a
humidity indicator. Since the optical characteristics of the photointerrputer may be affected during soldering
by vaporization of the moisture which is absorbed in storable period, it should be stored under the following
conditions:
1. If the aluminum bag has been stored unopened
Temperature: 5 to 30°C
Relative humidity: 90% RH (max)
Time: 12 months
2. If the aluminum bag has been opened
Temperature: 5 to 30°C
Relative humidity: 70% RH (max)
Time: 168 h
3. Baking should be conducted within 72 h after the humidity indicator shows > 30% or the bag seal date
is over 12 months. The number of baking should be once. If the baking is conducted repeatedly, it may
affect the peel-back force and cause a problem for mounting.
Baking condition: 60 ± 5°C, 12 to 24 h
Storage period: 12 months from the seal date on the label
4. When the photointerrupter is baked, protect it from electrostatic discharge.
5. Do not toss or drop to avoid damaging the moisture-proof bag.
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