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TLP848
2007-10-01
5
Mounting Methods
1. The example of temperature profile (reflow soldering)
• The first reflow process should be performed under the above temperature profile within 168 h
after opening the bag.
• If a second reflow process needs to be performed, it should be performed within 168 h of the first
reflow under the above temperature profile.
• Storage conditions before the second reflow process: 30°C, 70% RH (max)
• Do not perform wave soldering and manual soldering with a soldering iron.
2. Recommended soldering pattern
Unit: mm
3. Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test
(under the recommended conditions).
In selecting the one for your actual usage, please perform sufficient review on washing condition,
using condition and etc.
ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)
KAO CLEAN TROUGH 750H : (made by KAO)
PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL)
TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES)
(FRW-17, FRW-1, FRV-100)
0.575
1.075
1.0
1.5
30
∼
50 s
Time (s) →
60∼120 s
Package surface temperature (°C) →
250°C max (*)
230°C
180°C
160°C
10 s max (*)
4°C/s max (*)
4°C/s max (*)
(
*
)
The product is evaluated using above reflow soldering conditions. No additional test is performed
exceed the condition (i.e. the condition more than MAX values) as an evaluation.
Please
p
erform reflow solderin
g
under the above conditions.