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ICX418AKL
Package Outline Unit: mm
Sony Corporation
0.3
M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
Cer-DIP
TIN PLATING
42 ALLOY
2.6g
DRAWING NUMBER
AS-B14-01(E)
A
1
1
0˚ to 9˚
H
V
C
B
~
~
20pin DIP (600mil)
20
10
11
10
11
20
(0.7R) φ1.4
15.24
0.25
18.0 ± 0.4
9.0
7.55
15.1 ± 0.3
1.27
4.0 ± 0.3
14.6
3
0.55
3
11.55
3
0.7
0.8
1.778
0.4
(4.0)
(1.7)
1.4
(1.0)
0.70
3.26 ± 0.3
0.46
0.4
0.51
~
B'
1. “A” is the center of the effective image area.
2. The two points “B” of the package are the horizontal reference.
The point “B'” of the package is the vertical reference.
3. The bottom “C” of the package is the height reference.
4. The center of the effective image area, relative to “B” and “B'” is
(H, V) = (9.0, 7.55) ± 0.15mm.
5. The rotation angle of the effective image area relative to H and V is ± 1˚.
6. The height from the bottom “C” to the effective image area is 1.41 ± 0.15mm.
7. The tilt of the effective image area relative to the bottom “C” is less than 60µm.
8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.
9. The notch and the hole on the bottom must not be used for reference of fixing.