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2002 Oct 23 23
Philips Semiconductors Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
1.60
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
o
0.12 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 MS-026136E05
99-12-27
00-01-19
D
(1) (1)(1)
7.1
6.9
H
D
9.15
8.85
E
Z
0.95
0.55
D
b
p
e
E
B
12
D
H
b
p
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
1
48
37
36
25
24
13
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
X
y
c
w M
w M
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2