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© Philips Electronics N.V. 2001. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 16 January 2001 Document order number: 9397 750 07918
Contents
Philips Semiconductors
TDA9964
12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras
1 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Application information. . . . . . . . . . . . . . . . . . 15
11.1 Power and grounding recommendations . . . . 16
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Handling information. . . . . . . . . . . . . . . . . . . . 18
14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18
14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 18
14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 19
14.5 Package related soldering information . . . . . . 19
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 21
17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21