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Getting Started
Precautions
5
Getting Started
Precautions
Operating or storage location
• Operating or storing the camera in the following
locations may cause damage to the camera:
– Extremely hot or cold places (Operating
temperature: 0
°C to 40°C [32°F to 104°F])
– Exposed in direct sunlight for a long time, or close
to heating equipment (e.g., near heaters)
– Close to sources of strong magnetism
– Close to sources of powerful electromagnetic
radiation, such as radios or TV transmitters
– Locations subject to strong vibration or shock
• Use of a mobile phone close to this camera may cause
a malfunction of the camera or affect the quality of
images. You are cautioned to turn off any mobile
phone near the camera.
• Never expose the lens to the sun or other strong
light source.
Exposing the lens to the sun or other strong light
source may cause damage to internal parts from
concentrated light. When the camera is not be used,
keep it out of direct sunlight and other strong light or
protect it with a lens cover.
Ventilation
To prevent heat buildup, do not block air circulation
around the camera.
Transportation
When transporting the camera, repack it as originally
packed at the factory or in materials equal in quality.
Cleaning
• Use a blower to remove dust from the lens or optical
filter.
• Use a soft, dry cloth to clean the external surfaces of
the camera. Stubborn stains can be removed using a
soft cloth dampened with a small quantity of detergent
solution, then wipe dry.
• Do not use volatile solvents such as alcohol, benzene
or thinners as they may damage the surface finishes.
The pan/tilt mechanism
Do not disturb pan/tilt movement while power is
supplied to the camera. Doing so may cause damage or
malfunction.
Maintenance
The camera mechanism may cause abnormal noise due
to wear and lubrication loss after a long period of use. To
maintain optimum performance, we recommend
periodical maintenance. If abnormal noise occurs,
consult with your Sony dealer.
Note on laser beams
Laser beams may damage a CMOS image sensor. You are
cautioned that the surface of a CMOS image sensor should
not be exposed to laser beam radiation in an environment
where a laser beam device is used.